Package Design Engineer

Qualcomm Technologies, Inc. is seeking a talented Package Design Engineer to join their Data Center team. This role presents an exciting opportunity to work on cutting-edge technology in server solutions for data center applications.

The position involves leading advanced package selection, new generation product package structure, and configuration optimization. You'll be responsible for Package/SIP physical design and layout, working closely with multi-functional teams to achieve optimized mechanical, electrical, and thermal performance for various types of chips.

As a Package Design Engineer, you'll implement physical design of packages and modules for SoC, interface with multiple groups throughout Qualcomm on new product package/SiP feasibility analysis, and define design verification strategies. The role requires expertise in package pin out optimization and ensuring designs meet SI/PI requirements.

The ideal candidate will have a Bachelor's or Master's degree in electrical engineering, mechanical engineering, or related fields, with 3+ years of experience. Proficiency in Cadence APD & SiP and knowledge of IC packaging structures are essential. You'll join a company known for innovation and excellent benefits, including competitive compensation, annual RSU grants, comprehensive healthcare, and educational support.

This role offers significant growth opportunities within Qualcomm's dynamic environment, where you'll contribute to developing next-generation server solutions. You'll work alongside industry experts and have access to cutting-edge technology and resources. The position is based in our state-of-the-art facilities, offering a collaborative workspace and the chance to impact the future of data center technology.

Join Qualcomm to be part of a team that's pushing the boundaries of what's possible in server solutions and package design. Your expertise will directly contribute to developing innovative solutions that power the next generation of data centers.