Package Design Engineer
Description For Package Design Engineer
Qualcomm Technologies, Inc. is seeking a Package Design Engineer to join their Data Center team, focusing on developing high-performance, energy-efficient server solutions. This role combines technical expertise in package design with cross-functional collaboration to deliver cutting-edge technology solutions. The position requires strong skills in package/SIP physical design, layout optimization, and verification, while working with various teams to achieve optimal mechanical, electrical, and thermal performance. Candidates should have 3+ years of experience with a strong educational background in electrical engineering, mechanical engineering, or related fields. The role offers competitive compensation ranging from $154,000 to $252,800, along with comprehensive benefits including medical coverage, 401k, and equity opportunities. This position represents an opportunity to work with industry leaders in technology innovation while contributing to next-generation product development.
Responsibilities For Package Design Engineer
- Own and drive advanced package selection, new generation product package structure, and configuration optimization
- Responsible for Package/SIP physical design and layout, optimization, DV, and tape out
- Work with multi-functional teams to achieve optimized mechanical, electrical, and thermal performance
- Implement the physical design of packages and modules for SoC
- Interface and coordinate with multi-functional groups on new product package/SiP feasibility analysis
- Define and develop design verification and automation strategy
- Work multi-functionally to optimize package pin out
- Ensure package design is optimized with SI/PI requirements
Requirements For Package Design Engineer
- Bachelor's or Master's degree in electrical engineering, mechanical engineering, material science, or related fields
- Proficient in Cadence APD & SiP
- Basic knowledge in high-speed IO interfaces and electromagnetic field
- Knowledge of IC packaging structures, chip-package, and package-board interaction
- Basic knowledge of electronic packaging process and typical failure modes
Benefits For Package Design Engineer
- Competitive annual discretionary bonus program
- Annual RSU grants
- Medical coverage
- Dental coverage
- Vision coverage
- 401k
- Education assistance
Jobs Related To Qualcomm Package Design Engineer
