Principal Engineer, Packaging

Qualcomm Technologies is seeking a Principal Engineer for their Package Electrical Team, focusing on signal integrity and power integrity. This leadership role involves working with package and IC designers to optimize package design for data center applications. The position requires collaboration across multiple organizations including PHY team, Package team, PCB team, and PSIG. The ideal candidate will have extensive experience in DDR/SerDes design, system-level analysis, and package design optimization. They will be responsible for providing technical guidelines to upper management and ensuring system-level constraints are met. The role offers opportunities to work with cutting-edge technology and contribute to high-performance server solutions. Qualcomm provides comprehensive benefits including competitive salary, bonuses, RSU grants, and various wellness programs. The company fosters an inclusive culture that supports professional growth through continuous learning, mentorship, and development programs.