Sr Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort, Assembly)

A leading technology company specializing in wireless and semiconductor technologies.
Hardware
Staff Software Engineer
In-Person
10+ years of experience
Enterprise SaaS

Description For Sr Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort, Assembly)

Qualcomm Asia Pacific Pte. Ltd. is seeking a Senior Staff R&D Design Technology Integration Engineer to join their team focused on RF Front End Modules for the Cellular and Wireless Data markets. This role represents an exciting opportunity to work at the forefront of semiconductor packaging technology.

The position requires a senior technical specialist who can provide leadership in developing new and sustainable technology platforms. You'll be working directly with and supporting multiple product development teams within the Business Unit Engineering organization. This role combines technical expertise with leadership responsibilities in a dynamic, fast-paced environment.

Key responsibilities include supporting the development of advanced technologies for Si/GaAs backend interconnect, managing and improving existing processes, and leading technology integration efforts. You'll work closely with fabrication facilities and Outsourced Semiconductor Assembly and Test (OSAT) companies, requiring deep knowledge of Backend-of-the-Line (BEOL) processes and RF-SiP applications.

The ideal candidate will bring 10+ years of experience in electronics packaging, with at least 5 years of direct experience in process engineering or quality management at tier 1 foundries. A Master's degree in Mechanical, Materials, or Chemical Engineering is required, with a PhD preferred. You should possess solid technical understanding of semiconductor packaging materials, industry standards, and reliability methods.

At Qualcomm, you'll be part of a company that values innovation and technological advancement. We offer comprehensive benefits including world-class health coverage, financial planning programs, mental health support, and continuous learning opportunities. Join us in pushing the boundaries of semiconductor technology and contributing to next-generation wireless solutions.

This role offers the opportunity to work with cutting-edge technology, lead important initiatives, and collaborate with global teams. If you're passionate about semiconductor technology and ready to take on a leadership role in R&D, we want to hear from you.

Last updated 3 days ago

Responsibilities For Sr Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort, Assembly)

  • Support development of advanced technologies for Si / GaAs backend interconnect, passivation, RDL, bump and flip chip packaging
  • Monitor and improve existing processes to improve yield, quality, and throughput
  • Lead all aspects technology integration into products
  • Interface with foundries and OSATs for direct project management
  • Resolve quality, yield and manufacturing problems
  • Team cross-functionally with Design, Device process development, Packaging, FEA and global NPI teams
  • Ensure product readiness for ramp

Requirements For Sr Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort, Assembly)

  • Master's Degree or equivalent in Mechanical / Materials / Chemical Engineering (PHD Preferred)
  • 10+ years of experience in electronics packaging
  • At least 5 years direct experience in process engineering
  • Solid technical understanding of Semiconductor packaging materials
  • Good knowledge of packaging industry standards
  • Understanding of package/product qualification and reliability methods
  • Excellent communication skills
  • Willingness to travel internationally

Benefits For Sr Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort, Assembly)

Medical Insurance
Dental Insurance
Vision Insurance
Mental Health Assistance
Education Budget
  • World-class health coverage
  • Financial planning programs
  • Mental health support
  • Wellbeing programs
  • Continuous learning and development programs
  • Tuition reimbursement
  • Mentorship opportunities

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