Sr Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort, Assembly)

A global technology company specializing in semiconductor and telecommunications equipment.
Hardware
Staff Software Engineer
In-Person
5,000+ Employees
10+ years of experience
Enterprise SaaS · Hardware

Description For Sr Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort, Assembly)

Qualcomm Asia Pacific is seeking a Senior Staff R&D Design Technology Integration Engineer to join their team focused on RF Front End Modules for Cellular and Wireless Data markets. This role requires a senior technical specialist who can provide leadership in developing new technology platforms. The position involves working with multiple product development teams in a dynamic, fast-paced environment. The ideal candidate will have extensive experience in semiconductor packaging, process engineering, and quality management. They will be responsible for developing advanced technologies, improving processes, and ensuring product quality and reliability. The role offers opportunities for professional growth through continuous learning, mentorship, and collaboration with industry experts. Qualcomm provides comprehensive benefits including health coverage, financial planning support, and wellbeing programs. The company fosters an inclusive culture where innovative ideas contribute to world-changing technologies.

Last updated 13 days ago

Responsibilities For Sr Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort, Assembly)

  • Support development of advanced technologies for Si / GaAs backend interconnect, passivation, RDL, bump and flip chip packaging
  • Monitor and improve existing processes to improve yield, quality, and throughput
  • Lead technology integration into products and perform technical risk assessment
  • Interface with foundries and OSATs for project management
  • Team cross-functionally with Design, Device process development, Packaging, FEA and global NPI teams
  • Ensure product readiness for ramp and protect product integrity

Requirements For Sr Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort, Assembly)

  • Master's Degree or equivalent in Mechanical/Materials/Chemical Engineering (PhD Preferred)
  • 10+ years of experience in electronics packaging, especially RF module industry
  • 5+ years direct experience in process engineering or product integration
  • Solid technical understanding of Semiconductor packaging materials
  • Good knowledge of packaging industry standards
  • Understanding of package/product qualification and reliability methods
  • Excellent communication skills
  • Willingness to travel internationally

Benefits For Sr Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort, Assembly)

Medical Insurance
Dental Insurance
Vision Insurance
Mental Health Assistance
Education Budget
  • World-class health coverage for employees and dependents
  • Financial planning and future security programs
  • Emotional and mental wellbeing support
  • Continuous learning and development programs
  • Tuition reimbursement
  • Mentorship programs

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