Staff Engineer, Packaging

Qualcomm develops high performance, energy efficient server solutions for data center applications, focusing on cutting-edge technology.
$154,000 - $231,000
Backend
Staff Software Engineer
In-Person
5000+ Employees
8+ years of experience
Enterprise SaaS

Description For Staff Engineer, Packaging

Qualcomm Technologies, Inc. is seeking a Staff Engineer, Packaging to join their Data Center team. This role represents an exciting opportunity to work at the forefront of hardware design, specifically focusing on 2.5D/3D IC package design and analysis.

The position involves working with cutting-edge technology in Qualcomm's data center solutions division, where the focus is on developing high-performance, energy-efficient server solutions. As an EDA engineer in the advanced packaging space, you'll play a crucial role in guiding design and EE teams to ensure alignment with product roadmap and requirements.

Key responsibilities include developing and qualifying 2.5D and 3D package EDA reference flows, partnering with industry vendors and foundries, and driving automation in package design processes. The ideal candidate will bring together expertise in semiconductor packaging with strong EDA tool research and software development capabilities.

Qualcomm offers a comprehensive compensation package including a competitive base salary range of $154,000 to $231,000, plus annual RSU grants and bonus opportunities. The company provides excellent benefits including medical, dental, and vision insurance, 401k, and various other perks supporting work-life balance.

The role is based in San Diego, California, where you'll work alongside industry leaders and contribute to groundbreaking technological advancements. This position offers significant opportunity for professional growth and impact in the semiconductor industry, particularly in advanced packaging technologies.

Qualcomm maintains a strong commitment to diversity and inclusion, providing equal opportunities to all qualified applicants. The company culture promotes innovation, collaboration, and continuous learning, making it an ideal environment for talented engineers looking to advance their careers in semiconductor packaging and design.

Join Qualcomm's team to be part of developing next-generation technologies while working with some of the industry's brightest minds in a supportive and dynamic environment.

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Responsibilities For Staff Engineer, Packaging

  • Develop, qualify, and certify 2.5D and 3D package EDA reference flows based on critical KPIs
  • Partner with EDA vendors, SOC Foundries, and packaging SAT houses to influence industry EDA roadmap
  • Collaborate with internal SOC and packaging design teams to define and deploy reference flows
  • Develop and Automate tools and methodology to accelerate Package and System Design, Analysis and Verification processes

Requirements For Staff Engineer, Packaging

Java
  • Experience in 2.5D/3D IC package design and analysis
  • Background in semiconductor packaging
  • EDA tool research and software development expertise
  • Ability to guide design and EE teams

Benefits For Staff Engineer, Packaging

Medical Insurance
Dental Insurance
Vision Insurance
401k
  • Medical Insurance
  • Dental Insurance
  • Vision Insurance
  • 401k
  • Annual RSU grants
  • Annual discretionary bonus program
  • Competitive benefits package

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