Staff EDA Engineer, Packaging
Description For Staff EDA Engineer, Packaging
Qualcomm Technologies, Inc. is seeking a Staff EDA Engineer to join their Data Center team in San Diego. This role sits at the intersection of hardware design and advanced packaging, specifically focusing on 2.5D/3D IC package design and analysis. The position offers an opportunity to work with cutting-edge technology while developing and implementing EDA reference flows for next-generation packaging solutions.
The role requires a unique blend of technical expertise in semiconductor packaging and software development. You'll be responsible for developing and qualifying EDA reference flows, collaborating with industry partners, and driving automation initiatives to enhance package and system design processes. This position offers significant influence in shaping industry EDA roadmaps while working closely with internal teams to implement solutions that meet Qualcomm's product requirements.
The ideal candidate will bring a strong foundation in engineering or computer science, with hands-on experience in package design tools and automation. The position offers competitive compensation ranging from $154,000 to $231,000, along with comprehensive benefits including medical coverage, 401k, and equity through RSU grants.
Working at Qualcomm means joining a team at the forefront of data center technology innovation. You'll have the opportunity to contribute to world-changing innovations while working alongside industry experts. The company offers a supportive environment focused on professional growth, with access to continuous learning programs and mentorship opportunities.
This role is perfect for someone who combines technical expertise with leadership abilities, as you'll be guiding design and EE teams while collaborating across multiple stakeholders. If you're passionate about advanced packaging technology and want to make an impact in the semiconductor industry while working for a global technology leader, this position offers an excellent opportunity for career growth and technical innovation.
Responsibilities For Staff EDA Engineer, Packaging
- Develop, qualify, and certify 2.5D and 3D package EDA reference flows based on critical KPIs
- Partner with EDA vendors, SOC Foundries, and packaging SAT houses
- Collaborate with internal SOC and packaging design teams
- Develop and Automate tools and methodology to accelerate Package and System Design
Requirements For Staff EDA Engineer, Packaging
- Bachelor's degree in Engineering, Computer Science, or related field
- Development-level understanding of Chiplet driven packaging EDA reference flows
- Tool development and automation experience for Cadence APD/SIP, Cadence Innovus, Cadence Virtuoso
- Understanding of package design and SOC design flow
- Self-motivated with ability to solve complex problems
- Excellent verbal and written communication skills
Benefits For Staff EDA Engineer, Packaging
- Annual discretionary bonus program
- Annual RSU grants
- Competitive benefits package
- Medical coverage
- 401k program
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