Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort)

Join Qualcomm's elite team focused on RF Front End Modules for Cellular and Wireless Data markets. As a Staff R&D Design Technology Integration Engineer, you'll be part of the Business Unit Engineering organization, working directly with multiple product development teams. This role requires a senior technical specialist who can provide leadership in developing new and sustainable technology platforms.

The position offers an opportunity to work with cutting-edge semiconductor packaging technologies and processes, particularly in RF module development. You'll be responsible for improving yields, quality, and throughput while ensuring product reliability. The role involves significant cross-functional collaboration with various teams including Design, Device process development, and global NPI teams.

The ideal candidate will bring extensive experience in electronics packaging, particularly in the RF module industry, with a strong background in materials, device physics, and process integration. You'll work with world-class facilities and teams, contributing to groundbreaking technologies that power modern wireless communications.

Qualcomm offers comprehensive benefits including world-class health coverage, financial planning support, and continuous learning opportunities. The company fosters an inclusive culture that encourages innovation and professional growth. This role provides an excellent opportunity to work with leading technology experts while making significant contributions to the future of wireless technology.