Telematics Chipset Principal Project Engineer

A company of inventors that unlocked 5G, transforming connectivity and creating technologies for automotive markets.
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Principal Software Engineer
In-Person
5,000+ Employees
7+ years of experience
Automotive · AI

Description For Telematics Chipset Principal Project Engineer

Qualcomm is seeking a Telematics Chipset Principal Project Engineer to join their innovative team in Bangalore. This role is crucial in developing next-generation connectivity solutions for automotive applications. As a key member of the Telematics Systems team, you'll lead chipset definition, productization, and hardware architecture initiatives. The position offers an opportunity to work with cutting-edge technology in the automotive sector, focusing on developing solutions that will shape the future of connected vehicles.

The role requires deep expertise in SoC development, automotive standards, and system integration. You'll be responsible for leading cross-functional teams, managing product lifecycles, and ensuring compliance with automotive industry standards. The ideal candidate will have extensive experience in hardware development, reliability testing, and automotive ecosystem understanding.

Qualcomm offers a comprehensive benefits package, including world-class health coverage, financial planning support, and continuous learning opportunities. The company's culture promotes innovation, diversity, and professional growth, making it an ideal environment for experienced engineers looking to make a significant impact in the automotive technology sector.

This position presents an exciting opportunity to work at the intersection of telecommunications and automotive technology, contributing to solutions that will define the future of connected vehicles. The role offers exposure to advanced technologies, collaborative work environment, and the chance to work with industry-leading experts in both automotive and telecommunications domains.

Last updated 22 days ago

Responsibilities For Telematics Chipset Principal Project Engineer

  • Chipset definition, productization and hardware architecture for telematics systems
  • Leading cross functional teams for design, validation and roadmap needs
  • Working with product development teams to capture product requirements
  • Managing qualification testing, debugs and productizations
  • Addressing electrical, mechanical, power and thermal challenges
  • Working with SoC Design, DV, DFT, SVE teams

Requirements For Telematics Chipset Principal Project Engineer

Linux
  • Bachelor's degree in Engineering, Information Systems, EE Engineering or related field
  • 7+ years Systems Engineering or related work experience
  • Experience with reliability testing (AECQ100 preferred)
  • Understanding of automotive ecosystem, AECQ, ASIL, APQC, PPAP processes
  • Knowledge of vehicle networks, communication protocol and diagnostics
  • Experience with SoC Design and Development
  • Experience with automotive grade reliability standards

Benefits For Telematics Chipset Principal Project Engineer

Medical Insurance
Dental Insurance
Vision Insurance
Mental Health Assistance
Education Budget
  • World-class health coverage for employees and dependents
  • Financial planning and future security programs
  • Emotional/mental health support
  • Wellbeing programs
  • Continuous learning and development programs
  • Tuition reimbursement
  • Mentorship programs

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