Thermal Engineer

Qualcomm Technologies, Inc. is seeking a talented Thermal Engineer to join their Data Center team. This role presents an exciting opportunity to work on cutting-edge technology in high-performance computing.

The position involves working with a world-class team developing next-generation computing platforms that push the boundaries of performance and energy efficiency. As a Thermal Engineer, you'll be responsible for crucial aspects of thermal design and optimization for server solutions.

Your role will encompass conducting sophisticated thermal simulations, testing, and characterization to validate and enhance thermal models for high-performance computing systems. You'll work closely with cross-functional teams, including packaging, electrical, and mechanical engineers, to ensure optimal thermal solutions.

Key aspects of the role include:

• Leading thermal modeling at die, package, and system levels
• Developing and validating thermal solutions for advanced server designs
• Collaborating with internal teams and external suppliers
• Researching and implementing innovative thermal management solutions

The ideal candidate brings strong technical expertise in thermal engineering, with experience in CFD modeling tools and a deep understanding of heat transfer principles. You'll need excellent communication skills to work effectively across teams and present technical findings to stakeholders.

This position offers competitive compensation ($192,600 - $330,400) and comprehensive benefits including medical, dental, vision, 401k, and educational support. Join Qualcomm to be part of transforming the data center industry through innovative thermal solutions.