Process Engineer_ Backend Packaging

RF360 Singapore, a Qualcomm company, is seeking a Process Engineer specializing in Backend Packaging to join their semiconductor manufacturing team. This role offers an exciting opportunity to work with cutting-edge semiconductor technology and contribute to world-class products.

The position involves managing critical backend semiconductor processes, including wafer bumping, singulation, and mounting. You'll be responsible for maintaining high production standards, optimizing processes, and driving quality improvements. The ideal candidate will combine technical expertise with strong analytical and problem-solving skills.

Working at Qualcomm means joining a global leader in technology innovation, where you'll collaborate with industry experts and contribute to breakthrough technologies. The company offers comprehensive benefits, including world-class health coverage, financial planning support, and professional development opportunities through mentorship and tuition reimbursement.

This role is perfect for engineers passionate about semiconductor manufacturing who want to grow their careers in a dynamic, fast-paced environment. You'll be part of a team that values innovation, collaboration, and continuous improvement, while working on technologies that impact lives globally.