IC Package Design Engineer
Description For IC Package Design Engineer
SpaceX, a pioneering space exploration company, is seeking an IC Package Design Engineer to join their Silicon Engineering team. This role is crucial in developing silicon technologies for Starlink's low earth orbit satellites, focusing on delivering broadband connectivity to underserved areas.
The position offers an exciting opportunity to work on cutting-edge silicon projects that drive integration, lower power consumption, and advanced mixed signal architectures for both space and ground infrastructures. As an IC Package Design Engineer, you'll be an integral part of the IC design team, leading packaging efforts for custom in-house RFICs that support digital beam formers and modems.
The role demands expertise in package design, optimization, and verification, with responsibilities ranging from advanced package selection to simulating and optimizing signal/power integrity and RF performance. You'll work closely with cross-functional teams throughout SpaceX, interfacing with OSATs and vendors for current and future product development.
Qualified candidates should have a Bachelor's degree in electrical engineering or physics, along with hands-on IC package design experience. The ideal candidate will possess strong knowledge of signal and power integrity fundamentals, substrate design experience, and proficiency with various design and simulation tools.
SpaceX offers a comprehensive benefits package including competitive base salary, equity opportunities, medical benefits, 401(k), and generous paid time off. This role provides an unique opportunity to contribute to SpaceX's mission of making humanity a multi-planetary species while working with cutting-edge technology in the space industry.
The position requires compliance with ITAR regulations, and SpaceX maintains a strong commitment to equal opportunity employment. Join SpaceX to be part of a team that's literally reaching for the stars while developing revolutionary technology that will shape the future of space exploration.
Responsibilities For IC Package Design Engineer
- Own and drive advanced package selection, new product BGA configuration and package structure
- Responsible for package/SIP layout, optimization, design verification and tapeout
- Interface and coordinate with cross-functional groups on new product package selection, feasibility analysis and design
- Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out
- Simulate and optimize signal/power integrity and RF performance of the package design
- Drive methodology, innovations, and productivity improvements in package design
- Interface and work with OSATs and vendors for the sourcing existing designs and future product development
Requirements For IC Package Design Engineer
- Bachelor's degree in electrical engineering or physics
- 1+ years hands on experience with IC package design experience
- Thorough understanding of signal and power integrity fundamentals
- Substrate design experience for RF, digital, high-speed and mixed signal die
- Experience with Cadence APD+/SIP design tools
- Experience in package design electrical review, SI/PI analysis
- Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, ADS
- Experience in package design for manufacturing reviews
- Familiar with BGA package substrate technologies
- Problem solver with strong engineering fundamentals
Benefits For IC Package Design Engineer
- Long-term incentives (company stock, stock options, long-term cash awards)
- Discretionary bonuses
- Employee Stock Purchase Plan
- Comprehensive medical, vision, and dental coverage
- 401(k) retirement plan
- Short & long-term disability insurance
- Life insurance
- Paid parental leave
- 3 weeks paid vacation
- 10+ paid holidays per year
- 5 days sick leave per year
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