Principal IC Packaging Engineer, Silicon Technology (Starlink)
Description For Principal IC Packaging Engineer, Silicon Technology (Starlink)
SpaceX, founded with the vision of exploring the stars, is seeking a Principal IC Packaging Engineer for their Starlink project. Starlink, the world's largest satellite constellation, provides fast, reliable internet to over 4 million users worldwide. The role involves leading the development of advanced semiconductor packaging for Starlink's integrated circuits.
As a Principal IC Packaging Engineer, you'll own packaging assembly processes, develop new technologies, and establish baselines for assembly and packaging. You'll be responsible for new product and technology introductions, prototype development, and production releases. The role requires interfacing with various teams and suppliers to meet quality, reliability, cost, and production targets.
This position offers an opportunity to work on cutting-edge technology that has a global impact. You'll be part of a team that designs, builds, tests, and operates all parts of the Starlink system, including satellites and consumer receivers. The role demands expertise in advanced semiconductor packaging assembly design, development, equipment, and testing.
SpaceX offers a competitive compensation package, including potential stock options, bonuses, and comprehensive benefits. This is a chance to contribute to SpaceX's mission of making life multi-planetary while working on technology that's improving internet access worldwide.
Responsibilities For Principal IC Packaging Engineer, Silicon Technology (Starlink)
- Own packaging assembly processes including material characterization and down-selection for wafer-level and chip-level systems
- Develop new technologies and establish baselines for assembly and packaging
- Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
- Own packaging prototypes, product development, and release to production
- Select equipment and material to meet quality, reliability, cost, yield, and production targets
- Interface with equipment and material suppliers
- Cross-functional interface with IC design, materials, thermal, systems, and production teams
- Implement advanced packaging solutions into SpaceX next generation products
Requirements For Principal IC Packaging Engineer, Silicon Technology (Starlink)
- Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other applied engineering discipline
- 10+ years of professional experience in semiconductor assembly and packaging
- U.S. citizen, permanent resident, refugee, or asylee (due to ITAR requirements)
Benefits For Principal IC Packaging Engineer, Silicon Technology (Starlink)
- Long-term incentives (company stock, stock options, or long-term cash awards)
- Potential discretionary bonuses
- Employee Stock Purchase Plan
- Comprehensive medical, vision, and dental coverage
- 401(k) retirement plan
- Short & long-term disability insurance
- Life insurance
- Paid parental leave
- 3 weeks of paid vacation
- 10 or more paid holidays per year
- 5 days of sick leave per year (for exempt employees)
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