Principal IC Packaging Engineer, Silicon Technology (Starlink)
Description For Principal IC Packaging Engineer, Silicon Technology (Starlink)
SpaceX, a pioneering space technology company, is seeking a Principal IC Packaging Engineer to join their Starlink team. This role represents a unique opportunity to contribute to the world's largest satellite constellation, currently serving over 4 million users worldwide with high-speed internet access.
The position sits at the intersection of SpaceX's ambitious vision of making humanity multi-planetary and their practical approach to vertical integration. As part of their strategy to make Starlink more accessible and affordable, SpaceX is bringing integrated circuit packaging and assembly in-house for both development and manufacturing.
As the Principal IC Packaging Engineer, you'll take full ownership of packaging modules and products, working with cutting-edge technology in semiconductor packaging assembly design, development, equipment, and testing. The role demands expertise in advanced packaging solutions, including wafer-level and chip-level systems, SMT, flip chip, bonding, and various other specialized processes.
The ideal candidate brings at least 10 years of professional experience in semiconductor assembly and packaging, with a strong educational background in engineering or related fields. Additional experience with 2D, 2.5D, and 3D packaging integration, along with hands-on PCBA and SMT assembly experience, would be highly valuable.
This role offers competitive compensation ranging from $170,000 to $235,000 annually, complemented by an attractive benefits package including equity opportunities, comprehensive healthcare, 401(k), and various other perks. You'll be working in a fast-paced, innovative environment where your contributions will directly impact the future of global internet connectivity and space exploration.
Join SpaceX if you're passionate about pushing the boundaries of technology, want to be part of a team that's revolutionizing satellite internet connectivity, and are excited about contributing to humanity's journey to Mars. This role offers the unique opportunity to work on cutting-edge technology while being part of a mission that extends beyond Earth.
Responsibilities For Principal IC Packaging Engineer, Silicon Technology (Starlink)
- Own packaging assembly processes including material characterization and down-selection for wafer-level and chip-level systems
- Develop new technologies and establish baselines for assembly and packaging
- Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
- Own packaging prototypes, product development, and release to production
- Select equipment and material to meet quality, reliability, cost, yield, and production targets
- Interface with equipment and material suppliers
- Cross-functional interface with IC design, materials, thermal, systems, and production teams
- Implement advanced packaging solutions into SpaceX next generation products
Requirements For Principal IC Packaging Engineer, Silicon Technology (Starlink)
- Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other applied engineering discipline
- 10+ years of professional experience in semiconductor assembly and packaging
- Must be a U.S. citizen, permanent resident, refugee, or asylee due to ITAR requirements
Benefits For Principal IC Packaging Engineer, Silicon Technology (Starlink)
- Long-term incentives (company stock, stock options, long-term cash awards)
- Discretionary bonuses
- Employee Stock Purchase Plan
- Comprehensive medical, vision, and dental coverage
- 401(k) retirement plan
- Short & long-term disability insurance
- Life insurance
- Paid parental leave
- 3 weeks paid vacation
- 10+ paid holidays per year
- 5 days sick leave per year
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