SpaceX, a pioneering space technology company, is seeking a Senior IC Package Design Engineer to join their Silicon Engineering team. This role presents a unique opportunity to work on cutting-edge silicon development for Starlink's low earth orbit satellites, directly contributing to SpaceX's mission of making humanity a multi-planetary species.
The position involves leading the packaging efforts for custom in-house RFICs that support digital beam formers and modems. As a key member of the IC design team, you'll be responsible for driving advanced package selection, optimizing designs, and ensuring successful implementation of silicon solutions for space and ground infrastructures.
The ideal candidate brings 5+ years of hands-on IC package design experience, with a strong foundation in electrical engineering or physics. Your expertise should span signal and power integrity, substrate design for RF and mixed-signal applications, and proficiency with industry-standard tools like Cadence APD+/SIP, SIWave, HFSS, and ADS.
This role offers an exceptional opportunity to work at the intersection of space technology and silicon engineering, with direct impact on improving global internet connectivity through Starlink. The compensation package is highly competitive, ranging from $160,000 to $220,000 annually, complemented by comprehensive benefits including equity, medical coverage, and 401(k).
Working at SpaceX means joining a team of innovative problem-solvers who are pushing the boundaries of technology to achieve humanity's next giant leap. You'll collaborate across multiple teams, drive technological innovations, and play a crucial role in developing solutions that will be deployed in space. If you're passionate about combining IC design expertise with space exploration, this role offers the perfect platform to make a lasting impact on humanity's future in space.