IC Package Process Engineer, Dojo

Tesla's Dojo & Self-Driving Hardware team is seeking an IC Package Process Engineer to lead assembly processes for advanced IC packages, contributing to Tesla's Full Self-Driving (FSD) and High Performance Computing initiatives. This role is integral to the development of next-generation Self-Driving Hardware and the Dojo Super AI Computer.

The position offers an opportunity to work at the intersection of artificial intelligence and automotive technology, collaborating with various engineering teams including electrical, SI/PI, thermal/mechanical, and package design. The engineer will be responsible for pathfinding, development, and high-volume manufacturing design, while interfacing with various vendors including material, substrate, memory, foundry, and assembly houses.

This is a highly visible role that requires a strong growth mindset and versatility in a dynamic environment. The compensation package is competitive, ranging from $120,000 to $264,000 annually, plus additional cash and stock awards. Tesla offers comprehensive benefits including medical, dental, and vision coverage, 401(k) matching, and various family-support programs.

The ideal candidate will bring 2+ years of experience in semiconductor packaging technology, with expert knowledge in 2D/2.5D/3D packaging technology. They will lead cross-functional teams and drive industry-advanced packaging solutions from concept to high-volume manufacturing. This role represents an exceptional opportunity to contribute to Tesla's mission of accelerating the world's transition to sustainable energy through cutting-edge AI and computing technology.