Tesla's Dojo & Self-Driving Hardware team is seeking an IC Package Process Engineer to lead assembly processes for advanced IC packages. This role is crucial for the next generation of Self-Driving Hardware and Dojo Super AI Computer development. The position involves close collaboration with EE, SI/PI, thermal/mechanical, and package design teams, as well as interfacing with various vendors. The role offers competitive compensation ranging from $120,000 to $264,000 annually, plus comprehensive benefits including medical, dental, and vision coverage with $0 payroll deduction. The position is based in the San Francisco Bay Area and requires 2+ years of experience in semiconductor packaging technology. This is an opportunity to contribute to cutting-edge AI and autonomous driving technology development at one of the world's most innovative companies.