Staff IC Packaging Mechanical Engineer, Dojo
Description For Staff IC Packaging Mechanical Engineer, Dojo
Tesla is seeking a Staff IC Package Mechanical Engineer to join their Dojo & Self-Driving Hardware team. This role represents a unique opportunity to work on cutting-edge technology at the intersection of AI and automotive innovation. The position involves developing advanced IC packaging solutions for Tesla's next-generation Self-Driving Hardware and Dojo Super AI Computer.
The role demands expertise in mechanical simulation and materials characterization, working closely with cross-functional teams including IC package integration, layout, EE, SI/PI, and thermal/mechanical teams. You'll collaborate with various vendors and drive packaging architecture pathfinding, design for manufacturing and reliability, and product level qualification.
Key responsibilities include performing complex numerical simulations, conducting first-principles analysis, and working with advanced packaging technologies. The ideal candidate will bring 5+ years of experience in IC packaging mechanical/material engineering, strong FEM tool expertise, and programming capabilities in Python and Matlab.
Tesla offers a comprehensive benefits package including competitive salary ranging from $120,000 to $264,000, plus stock awards. The company provides excellent healthcare coverage, 401(k) with employer match, and various family-friendly benefits. Working at Tesla's facility in the San Francisco Bay Area, you'll be at the forefront of developing technology that's transforming both the automotive and AI industries.
This position offers the opportunity to work on revolutionary projects that will shape the future of autonomous driving and AI computing. You'll be part of a dynamic team in a fast-paced environment, contributing to Tesla's mission of accelerating the world's transition to sustainable energy while working on some of the most advanced computing systems in the industry.
Responsibilities For Staff IC Packaging Mechanical Engineer, Dojo
- Perform numerical mechanical simulation of advanced IC packages
- Conduct first-principles analysis for component warpage and stress-strain
- Model and simulate manufacturing and assembly process
- Conduct first-order packaging thermal and mold flow analysis
- Perform packaging materials characterization
Requirements For Staff IC Packaging Mechanical Engineer, Dojo
- Degree or equivalent with 5+ year experience in IC packaging mechanical/material engineering
- Strong hands-on experience of major FEM tools (ANSYS, ABAQUS)
- Deep understanding of packaging materials, mechanical characterization and qualification methodology
- Knowledge of advanced packaging technology
- Excellent engineering problem solving skills
- Programming experience using Matlab, Python and fundamental machine learning capability
Benefits For Staff IC Packaging Mechanical Engineer, Dojo
- Aetna PPO and HSA plans with $0 payroll deduction
- Family-building, fertility, adoption and surrogacy benefits
- Dental and vision plans with $0 paycheck contribution
- Company Paid HSA Contribution
- Healthcare and Dependent Care Flexible Spending Accounts
- 401(k) with employer match
- Employee Stock Purchase Plans
- Company paid Basic Life, AD&D, short-term and long-term disability insurance
- Employee Assistance Program
- Sick and Vacation time
- Back-up childcare and parenting support resources
- Weight Loss and Tobacco Cessation Programs
- Tesla Babies program
- Commuter benefits
- Employee discounts and perks program
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